Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418267 | Method of processing a semiconductor wafer, semiconductor chip, and surface protective tape | Masami Aoyama | 2019-09-17 |
| 10307866 | Method of producing semiconductor chip, and mask-integrated surface protective tape used therein | Hirotoki Yokoi, Tomoaki Uchiyama | 2019-06-04 |