Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10196534 | Resin composition for sealing electronic device, and electronic device | Masami Aoyama, Yasushi Ishizaka, Tetsuya Mieda | 2019-02-05 |
| 10196547 | Resin composition for sealing electronic device, and electronic device | Masami Aoyama, Yasushi Ishizaka | 2019-02-05 |