Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10328606 | Cutting apparatus | — | 2019-06-25 |
| 10211164 | Semiconductor package manufacturing method | Youngsuk Kim, Byeongdeck Jang | 2019-02-19 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10328606 | Cutting apparatus | — | 2019-06-25 |
| 10211164 | Semiconductor package manufacturing method | Youngsuk Kim, Byeongdeck Jang | 2019-02-19 |