Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515841 | Method for dividing substrate along division lines using abrasive member having projection for cutting substrate | Byeongdeck Jang | 2019-12-24 |
| 10497623 | Method of manufacturing a semiconductor package including a shield layer | Byeongdeck Jang | 2019-12-03 |
| 10431555 | Method of manufacturing semiconductor package | Byeongdeck Jang | 2019-10-01 |
| 10403520 | Multi-blade and processing method of workpiece | Byeongdeck Jang, Takahiro Ishii, Maki Sakai | 2019-09-03 |
| 10366907 | Manufacturing method of semiconductor package | Byeongdeck Jang | 2019-07-30 |
| 10211164 | Semiconductor package manufacturing method | Byeongdeck Jang, Fumio Uchida | 2019-02-19 |
| 10184206 | Clothes treating apparatus and control method thereof | Injae HAN, Sangwook Hong | 2019-01-22 |