Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515841 | Method for dividing substrate along division lines using abrasive member having projection for cutting substrate | Youngsuk Kim | 2019-12-24 |
| 10497623 | Method of manufacturing a semiconductor package including a shield layer | Youngsuk Kim | 2019-12-03 |
| 10431555 | Method of manufacturing semiconductor package | Youngsuk Kim | 2019-10-01 |
| 10403520 | Multi-blade and processing method of workpiece | Youngsuk Kim, Takahiro Ishii, Maki Sakai | 2019-09-03 |
| 10366907 | Manufacturing method of semiconductor package | Youngsuk Kim | 2019-07-30 |
| 10211164 | Semiconductor package manufacturing method | Youngsuk Kim, Fumio Uchida | 2019-02-19 |