Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249547 | Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layer | Satoshi Kobayashi, Shunsuke Teranishi, Nobumori Ogoshi, Atsushi Ueki, Yuriko Sato | 2019-04-02 |