Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249547 | Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layer | Satoshi Kobayashi, Shunsuke Teranishi, Atsushi Ueki, Yuriko Sato, Yasuhiro Shimma | 2019-04-02 |