Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312144 | Method of dividing a wafer by back grinding | Yurika Araya, Tetsukazu Sugiya, Takashi Haimoto | 2019-06-04 |
| 10269639 | Method of manufacturing packaged wafer | Xin Lu, Yurika Araya | 2019-04-23 |