Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366925 | Wafer processing method | — | 2019-07-30 |
| 10312144 | Method of dividing a wafer by back grinding | Hideki Koshimizu, Yurika Araya, Takashi Haimoto | 2019-06-04 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366925 | Wafer processing method | — | 2019-07-30 |
| 10312144 | Method of dividing a wafer by back grinding | Hideki Koshimizu, Yurika Araya, Takashi Haimoto | 2019-06-04 |