Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269639 | Method of manufacturing packaged wafer | Hideki Koshimizu, Yurika Araya | 2019-04-23 |
| 10262899 | Method of processing wafer | Atsushi Kubo | 2019-04-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269639 | Method of manufacturing packaged wafer | Hideki Koshimizu, Yurika Araya | 2019-04-23 |
| 10262899 | Method of processing wafer | Atsushi Kubo | 2019-04-16 |