Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347533 | Power package module of multiple power chips and method of manufacturing power chip unit | Tao Wang, Kai Lu, Zeng Li, Jianhong Zeng | 2019-07-09 |
| 10340617 | Power modules and pin thereof | Le Liang, Shouyu Hong | 2019-07-02 |
| 10342153 | Stack structure and the manufacturing method of the same | Le Liang | 2019-07-02 |
| 10297523 | Power module and method for manufacturing the same | Shouyu Hong, Yanlin CHEN | 2019-05-21 |
| 10249550 | Power module with lead component and manufacturing method thereof | Pengkai Ji, Shouyu Hong, Jianhong Zeng | 2019-04-02 |