Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453956 | Semiconductor packaging structure | Chao Cai, Jian-Hong Zeng, Xiao-Ni Xin | 2019-10-22 |
| 10454312 | Wireless power transfer control apparatus and method | Hengchun Mao, Bo Yang | 2019-10-22 |
| 10347533 | Power package module of multiple power chips and method of manufacturing power chip unit | Tao Wang, Zhenqing Zhao, Kai Lu, Jianhong Zeng | 2019-07-09 |
| 10347758 | Semiconductor packaging structure and semiconductor power device thereof | Chao Cai, Jian-Hong Zeng | 2019-07-09 |
| 10276520 | Switch circuit package module | Shou-Yu Hong, Jian-Hong Zeng | 2019-04-30 |