Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340617 | Power modules and pin thereof | Shouyu Hong, Zhenqing Zhao | 2019-07-02 |
| 10342153 | Stack structure and the manufacturing method of the same | Zhenqing Zhao | 2019-07-02 |
| 10204882 | Stacked package module having an exposed heat sink surface from the packaging | Shou-Yu Hong, Zhen-Qing ZHAO | 2019-02-12 |
| 10198020 | Interleaved parallel circuit, integrated power module and integrated power chip | Chaofeng Cai, Yan Chen | 2019-02-05 |