Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381286 | Power module | Shou-Yu Hong, Gan Zhou, Jian-Hong Zeng | 2019-08-13 |
| 10314178 | Package module | Hai-Bin Xu, Tao Wang, Shou-Yu Hong | 2019-06-04 |
| 10276522 | Power module | Tao Wang, Kai Lu, Zheng-Fen Wan, Hai-Bin Xu | 2019-04-30 |
| 10204882 | Stacked package module having an exposed heat sink surface from the packaging | Le Liang, Shou-Yu Hong | 2019-02-12 |