Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453743 | Barrier layer removal method and semiconductor structure forming method | Zhaowei Jia, Dongfeng Xiao, Jian Wang | 2019-10-22 |
| 10410906 | Substrate supporting apparatus | Fuping Chen, Huaidong ZHANG, Wenjun Wang | 2019-09-10 |
| 10297472 | Method and apparatus for cleaning semiconductor wafer | Fuping Chen, Liangzhi Xie, Shena Jia, Xi Wang, Xiaoyan Zhang | 2019-05-21 |
| 10227705 | Apparatus and method for plating and/or polishing wafer | Jian Wang, Yinuo Jin, Hongchao Yang | 2019-03-12 |
| 10217662 | Method for processing interconnection structure for minimizing barrier sidewall recess | Zhaowei Jia, Jian Wang | 2019-02-26 |