Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438897 | Fiducial mark for chip bonding | Hiromitsu Kosugi, Alejandro Aldrin A. Narag, II, Ravi Palaniswamy | 2019-10-08 |
| 10424707 | Flexible LED assembly with UV protection | Ravi Palaniswamy, Alejandro Aldrin A. Narag, II, Hiromitsu Kosugi | 2019-09-24 |
| 10420215 | Flexible printed circuit and a method of fabricating a flexible printed circuit | Choong Meng How | 2019-09-17 |
| 10207916 | MEMS devices on flexible substrate | Phillip J. Bergeron, Brent D. Lunceford, John D. Geissinger, Douglas B. Gundel, Justine A. Mooney +1 more | 2019-02-19 |