Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438897 | Fiducial mark for chip bonding | Siang Sin Foo, Hiromitsu Kosugi, Alejandro Aldrin A. Narag, II | 2019-10-08 |
| 10424707 | Flexible LED assembly with UV protection | Alejandro Aldrin A. Narag, II, Siang Sin Foo, Hiromitsu Kosugi | 2019-09-24 |
| 10207916 | MEMS devices on flexible substrate | Phillip J. Bergeron, Brent D. Lunceford, John D. Geissinger, Douglas B. Gundel, Justine A. Mooney +1 more | 2019-02-19 |