Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438897 | Fiducial mark for chip bonding | Siang Sin Foo, Hiromitsu Kosugi, Ravi Palaniswamy | 2019-10-08 |
| 10424707 | Flexible LED assembly with UV protection | Ravi Palaniswamy, Siang Sin Foo, Hiromitsu Kosugi | 2019-09-24 |