Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966263 | Method of fabricating fin structure | Kun-Ju Li, Li-Chieh Hsu, Chun-Tsen Lu, Chih-Hsun Lin, Hsin-Jung Liu | 2018-05-08 |
| 9887158 | Conductive structure having an entrenched high resistive layer | Kun-Ju Li, Kuo-Chin Hung, Min-Chuan Tsai, Wei-Chuan Tsai, Chun-Tsen Lu +2 more | 2018-02-06 |