Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103034 | Method of planarizing substrate surface | Fu-Shou Tsai, Yu-Ting Li, Yi-Liang Liu, Kun-Ju Li | 2018-10-16 |
| 10049887 | Method of planarizing substrate surface | Fu-Shou Tsai, Yu-Ting Li, Yi-Liang Liu, Kun-Ju Li | 2018-08-14 |
| 9972498 | Method of fabricating a gate cap layer | Fu-Shou Tsai, Yu-Ting Li, Chih-Hsun Lin, Yi-Liang Liu, Po-Cheng Huang +2 more | 2018-05-15 |
| 9966263 | Method of fabricating fin structure | Kun-Ju Li, Yi-Han Liao, Chun-Tsen Lu, Chih-Hsun Lin, Hsin-Jung Liu | 2018-05-08 |
| 9905430 | Method for forming semiconductor structure | Fu-Shou Tsai, Yu-Ting Li, Yi-Liang Liu, Kun-Ju Li, Po-Cheng Huang +1 more | 2018-02-27 |
| 9887158 | Conductive structure having an entrenched high resistive layer | Kun-Ju Li, Kuo-Chin Hung, Min-Chuan Tsai, Wei-Chuan Tsai, Yi-Han Liao +2 more | 2018-02-06 |
| 9875909 | Method for planarizing material layer | Fu-Shou Tsai, Yu-Ting Li, Yi-Liang Liu, Kun-Ju Li, Po-Cheng Huang +1 more | 2018-01-23 |