Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984974 | Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer | Ching-Ling Lin, Chih-Sen Huang, Ching-Wen Hung, Jia-Rong Wu, Yi-Hui Lee +1 more | 2018-05-29 |
| 9899322 | Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer | Ching-Ling Lin, Chih-Sen Huang, Ching-Wen Hung, Jia-Rong Wu, Yi-Hui Lee +1 more | 2018-02-20 |