Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984974 | Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer | Chih-Sen Huang, Ching-Wen Hung, Jia-Rong Wu, Tsung-Hung Chang, Yi-Hui Lee +1 more | 2018-05-29 |
| 9899322 | Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer | Chih-Sen Huang, Ching-Wen Hung, Jia-Rong Wu, Tsung-Hung Chang, Yi-Hui Lee +1 more | 2018-02-20 |