Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109531 | Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof | Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu +2 more | 2018-10-23 |