Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109531 | Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof | An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu, Tien-Shan Hsu +2 more | 2018-10-23 |
| 10037915 | Fabricating method of a semiconductor structure with an epitaxial layer | Chun-Chia Chen, Yao-Jhan Wang | 2018-07-31 |