Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109531 | Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof | Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Tien-Shan Hsu +2 more | 2018-10-23 |
| 10062584 | Method for forming semiconductor structure | Kuan-Lin Chen, An-Chi Liu, Kun-Yuan Liao | 2018-08-28 |