Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141224 | Manufacturing method of interconnection structure | Dyi-Chung Hu, Yin-Po Hung, Ra-Min Tain | 2018-11-27 |
| 10083901 | Method for manufacturing circuit redistribution structure | Cheng-Ta Ko | 2018-09-25 |
| 10068847 | Package substrate and method of fabricating the same | Wei-Chung Lo, Dyi-Chung Hu, Chang-Hong Hsieh | 2018-09-04 |
| 9970519 | Circulation member positioning structure for ball screw | Ming-Yao Lin, Hui-Chen Chen, Tsung-Hsien Tsai | 2018-05-15 |
| 9887153 | Circuit redistribution structure unit and method for manufacturing circuit redistribution structure | Cheng-Ta Ko | 2018-02-06 |
| 9859159 | Interconnection structure and manufacturing method thereof | Dyi-Chung Hu, Yin-Po Hung, Ra-Min Tain | 2018-01-02 |
| 9860980 | Circuit board element | Yu-Chung Hsieh, Chun-Hsien Chien, Wei-Ti Lin | 2018-01-02 |