Issued Patents 2018
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157836 | Metal via structure | — | 2018-12-18 |
| 10154599 | Redistribution film for IC package | — | 2018-12-11 |
| 10153234 | System in package | — | 2018-12-11 |
| 10141224 | Manufacturing method of interconnection structure | Yin-Po Hung, Ra-Min Tain, Yu-Hua Chen | 2018-11-27 |
| 10141198 | Electronic package and manufacturing method thereof | — | 2018-11-27 |
| 10109598 | Composite carrier for warpage management | — | 2018-10-23 |
| 10090270 | Metal pillar with cushioned tip | — | 2018-10-02 |
| 10068838 | Glass fiber reinforced package substrate | — | 2018-09-04 |
| 10068847 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Chang-Hong Hsieh | 2018-09-04 |
| 10068889 | System in package | — | 2018-09-04 |
| 10049995 | Bonding film | — | 2018-08-14 |
| 10037946 | Package structure having embedded bonding film and manufacturing method thereof | — | 2018-07-31 |
| 10032702 | Package structure and manufacturing method thereof | — | 2018-07-24 |
| 10002852 | Package on package configuration | — | 2018-06-19 |
| 9972604 | Joint structure for metal pillars | — | 2018-05-15 |
| 9958616 | Embedded optical fiber module | — | 2018-05-01 |
| 9859130 | Manufacturing method of interposed substrate | Ming-Chih Chen, Tzyy-Jang Tseng | 2018-01-02 |
| 9859213 | Metal via structure | — | 2018-01-02 |
| 9859159 | Interconnection structure and manufacturing method thereof | Yin-Po Hung, Ra-Min Tain, Yu-Hua Chen | 2018-01-02 |
| 9859202 | Spacer connector | — | 2018-01-02 |