Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068847 | Package substrate and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2018-09-04 |
| 9931813 | Bonding structure and method of fabricating the same | Kuan-Neng Chen, Cheng-Ta Ko | 2018-04-03 |