YH

Yu-Tseng Hsien

TSMC: 1 patents #1,476 of 2,904Top 55%
📍 Tongxiao, TW: #1 of 1 inventorsTop 100%
Overall (2018): #179,004 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10042967 Electromigration sign-off methodology Chin-Shen Lin, Ching-Shun Yang, Jui-Feng Kuan 2018-08-07