Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163787 | Semiconductor structure | Hui Yu Lee, Feng-Wei Kuo, Yi-Kan Cheng | 2018-12-25 |
| 10162244 | Configurable heating device | Hui Yu Lee | 2018-12-25 |
| 10157252 | Method and apparatus of a three dimensional integrated circuit | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Yi-Kan Cheng | 2018-12-18 |
| 10095827 | Method of manufacturing a semiconductor device | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Yi-Kan Cheng | 2018-10-09 |
| 10083257 | Method, system and computer program product for generating simulation sample | Chin-Cheng Kuo, Wei Min Chan, Wei Hu | 2018-09-25 |
| 10042967 | Electromigration sign-off methodology | Yu-Tseng Hsien, Chin-Shen Lin, Ching-Shun Yang | 2018-08-07 |
| 9996643 | Integrated circuit modeling method using resistive capacitance information | Chin-Sheng Chen, Tsun-Yu Yang, Wei Hu, Ching-Shun Yang | 2018-06-12 |
| 9934352 | Method and system for manufacturing a semiconductor device | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Yi-Kan Cheng | 2018-04-03 |