Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096544 | Semiconductor interconnect structure | Chih-Ming Lai, Ru-Gun Liu, Pi-Tsung Chen | 2018-10-09 |
| 10078718 | Multiple patterning method for semiconductor devices | Ken-Hsien Hsieh, Chih-Ming Lai, Ru-Gun Liu, Wen-Li Cheng, Pai-Wei Wan | 2018-09-18 |
| 10049178 | Methodology for pattern density optimization | Hung-Chun Wang, Ming-Hui Chih, Ping-Chieh Wu, Chun-Hung Wu, Wen-Hao Liu +3 more | 2018-08-14 |
| 10036948 | Environmental-surrounding-aware OPC | Wen-Li Cheng, Ming-Hui Chih, Ru-Gun Liu | 2018-07-31 |
| 9911606 | Mandrel spacer patterning in multi-pitch integrated circuit manufacturing | Chia-Ping Chiang, Ya-Ting Chang, Wen-Li Cheng, Nian-Fuh Cheng, Ming-Hui Chih +2 more | 2018-03-06 |
| 9880460 | Enhanced EUV lithography system | Ching-Hsu Chang, Nian-Fuh Cheng, Chih-Shiang Chou, Ru-Gun Liu | 2018-01-30 |