Issued Patents 2018
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859258 | Semiconductor device and method of manufacture | Wei-Yu Chen, Tien-Chung Yang, Hsien-Wei Chen | 2018-01-02 |
| 9859245 | Chip package structure with bump and method for forming the same | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2018-01-02 |