HL

Hun Teak Lee

SC Stats Chippac: 1 patents #23 of 69Top 35%
Overall (2018): #393,180 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9997468 Integrated circuit packaging system with shielding and method of manufacturing thereof Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more 2018-06-12