Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141244 | TSV layout structure and TSV interconnect structure, and fabrication methods thereof | Xiaojun Chen, Xuanjie Liu, Haifang Zhang | 2018-11-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141244 | TSV layout structure and TSV interconnect structure, and fabrication methods thereof | Xiaojun Chen, Xuanjie Liu, Haifang Zhang | 2018-11-27 |