Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141244 | TSV layout structure and TSV interconnect structure, and fabrication methods thereof | Wuzhi Zhang, Xiaojun Chen, Xuanjie Liu | 2018-11-27 |
| 9984819 | Vertical inductor and method of manufacturing the same | Dekui Qi, Xuanjie Liu, Zheng Chen, Xin Li | 2018-05-29 |