Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141244 | TSV layout structure and TSV interconnect structure, and fabrication methods thereof | Wuzhi Zhang, Xuanjie Liu, Haifang Zhang | 2018-11-27 |
| 10111787 | Apparatus for a diaper, a system, a diaper and a method of manufacturing an electrode | Jackie Y. Ying, Guolin Xu, Rensheng Deng | 2018-10-30 |
| D818387 | Wireless doorbell set | — | 2018-05-22 |
| 9902005 | Low-boron-oxygen cutting line for one-way wire winding and manufacturing method thereof | Xianqi Meng, Linhui Wan, Huogen LIN, Fanglin Guo | 2018-02-27 |