Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090199 | Semiconductor device and method for supporting ultra-thin semiconductor die | Gordon M. Grivna | 2018-10-02 |
| 9911684 | Holes and dimples to control solder flow | Dennis Lee Conner, Jay A. Yoder | 2018-03-06 |
| 9870986 | Single or multi chip module package and related methods | Roger M. Arbuthnot, Jay A. Yoder, Dennis Lee Conner | 2018-01-16 |