Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9911684 | Holes and dimples to control solder flow | Stephen St. Germain, Jay A. Yoder | 2018-03-06 |
| 9870986 | Single or multi chip module package and related methods | Stephen St. Germain, Roger M. Arbuthnot, Jay A. Yoder | 2018-01-16 |