Issued Patents 2018
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147790 | Method of forming a semiconductor device and structure therefor | — | 2018-12-04 |
| 10121765 | Semiconductor device and method of forming WLCSP | — | 2018-11-06 |
| 10115790 | Electronic device including an insulating structure | Steve M. Etter, Hiroyuki Suzuki, Miki Ichiyanagi, Toshihiro Hachiyanagi | 2018-10-30 |
| 10109610 | Wire bonding systems and related methods | Wentao Qin, Harold Anderson, Thomas A. Anderson, George Chang | 2018-10-23 |
| 10090199 | Semiconductor device and method for supporting ultra-thin semiconductor die | Stephen St. Germain | 2018-10-02 |
| 10074611 | Semiconductor device and method of forming backside openings for an ultra-thin semiconductor die | — | 2018-09-11 |
| 10032937 | Monolithic series switching semiconductor device having low-resistance substrate contact structure and method | Ali Salih, Daniel R. Heuttl, Osamu Ishimaru, Thomas Keena, Masafumi Uehara | 2018-07-24 |
| 10026605 | Method of reducing residual contamination in singulated semiconductor die | Jason Doub | 2018-07-17 |
| 10014217 | Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface | — | 2018-07-03 |
| 9991338 | Electronic device including a conductive structure surrounded by an insulating structure | — | 2018-06-05 |
| 9960265 | III-V semiconductor device and method therefor | Abhishek Banerjee, Peter Moens | 2018-05-01 |
| 9917013 | Method of separating electronic devices having a back layer | — | 2018-03-13 |
| 9911654 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman | 2018-03-06 |
| 9859419 | Stacked-gate super-junction MOSFET | Gary H. Loechelt | 2018-01-02 |