Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10038006 | Through-memory-level via structures for a three-dimensional memory device | Jixin Yu, Hiroyuki Ogawa, James Kai, Jin Liu, Johann Alsmeier | 2018-07-31 |
| 9978766 | Three-dimensional memory device with electrically isolated support pillar structures and method of making thereof | Naohiro Hosoda, Takeshi Kawamura, Kota Funayama | 2018-05-22 |