Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978661 | Packaged semiconductor chips having heat dissipation layers and ground contacts therein | Oleg Feygenson, Sang-Il Kim, Youngbae Kim, Jichul Kim, Seungkon Mok +1 more | 2018-05-22 |