Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043789 | Semiconductor packages including an adhesive pattern | — | 2018-08-07 |
| 9978661 | Packaged semiconductor chips having heat dissipation layers and ground contacts therein | Yunhyeok Im, Oleg Feygenson, Sang-Il Kim, Jichul Kim, Seungkon Mok +1 more | 2018-05-22 |