Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978661 | Packaged semiconductor chips having heat dissipation layers and ground contacts therein | Yunhyeok Im, Oleg Feygenson, Sang-Il Kim, Youngbae Kim, Seungkon Mok +1 more | 2018-05-22 |
| 9903764 | Integrated circuit for estimating power of at least one node using temperature and a system including the same | Kyungsoo Lee, Sridhar Sundaram, Wook Kim, Myungkyoon Yim | 2018-02-27 |