Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941243 | Wafer-to-wafer bonding structure | Tae-Yeong Kim, Seok Ho Kim, Kwang-Jin Moon, Ho-Jin Lee | 2018-04-10 |
| 9935037 | Multi-stacked device having TSV structure | Ho-Jin Lee, Byung-Lyul Park, Tae-Yeong Kim, Seok Ho Kim | 2018-04-03 |
| 9865581 | Method of fabricating multi-substrate semiconductor devices | Joo-Hee Jang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Byung-Lyul Park +4 more | 2018-01-09 |