Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941243 | Wafer-to-wafer bonding structure | Tae-Yeong Kim, Pil-Kyu Kang, Seok Ho Kim, Ho-Jin Lee | 2018-04-10 |
KM
Kwang-Jin Moon
Overall (2018): #335,748 of 503,207Top 70%
1
Patents 2018