Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10165349 | Audio output device and electronic device connected therewith | Kang Ho Park | 2018-12-25 |
| 10128168 | Integrated circuit device including through-silicon via structure and method of manufacturing the same | Ju-Il Choi, Kun-Sang Park, Son-Kwan Hwang, Ji-Soon Park | 2018-11-13 |
| 10103098 | Semiconductor devices including a through via structure and methods of forming the same | Deokyoung Jung, Kwangjin Moon, Jin Ho An | 2018-10-16 |
| 9935037 | Multi-stacked device having TSV structure | Pil-Kyu Kang, Ho-Jin Lee, Tae-Yeong Kim, Seok Ho Kim | 2018-04-03 |
| 9922897 | Method of manufacturing semiconductor package | Kyoung Hwan Kim, TaeWoo Kang, Hyungjun Jeon | 2018-03-20 |
| 9865581 | Method of fabricating multi-substrate semiconductor devices | Joo-Hee Jang, Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim +4 more | 2018-01-09 |
| 9859191 | Semiconductor device including conductive via with buffer layer at tapered portion of conductive via | Ho-Jin Lee, Jin Ho An | 2018-01-02 |