Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978721 | Apparatus for stacked semiconductor packages and methods of fabricating the same | Heung-Kyu Kwon, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2018-05-22 |
| 9899294 | Thermal interface material layer and package-on-package device including the same | Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2018-02-20 |