Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899294 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2018-02-20 |
HR
Hyo-Chang Ryu
Overall (2018): #391,256 of 503,207Top 80%
1
Patents 2018