Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899294 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2018-02-20 |
JK
Jongkook Kim
Overall (2018): #363,694 of 503,207Top 75%
1
Patents 2018