Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9893016 | Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same | Hajime Sakamoto, Shigeru Yamada, Takashi Kariya | 2018-02-13 |